基于铜基的多层氮化硼薄膜（52.5cm）

简要描述：Specifications:
Close to complete coverage （90-95%）, with some minor holes
Average Thickness of BN film is 13 nm
Thickness of the copper foil is 20 microns
Quality is confirmed by TEM.

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更新时间：2024-06-03
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详细介绍

Specifications:

Close to complete coverage (90-95%), with some minor holes

Average Thickness of BN film is 13 nm

Thickness of the copper foil is 20 microns

Quality is confirmed by TEM. TEM shows perfect hexagonal structure.

Specifications:

Close to complete coverage (90-95%), with some minor holes

Average Thickness of BN film is 13 nm

Thickness of the copper foil is 20 microns

Quality is confirmed by TEM. TEM shows perfect hexagonal structure.

Specifications:

Close to complete coverage (90-95%), with some minor holes

Average Thickness of BN film is 13 nm

Thickness of the copper foil is 20 microns

Quality is confirmed by TEM. TEM shows perfect hexagonal structure.

TEM image of perfect hexagonal structure

AFM image of multilayer BN on Cu

AFM scan of multilayer BN on Cu

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基于铜基的多层氮化硼薄膜（52.5cm）

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